The AG Termo Thermal Adhesive Glue (10g) is a high-performance thermally conductive adhesive designed for attaching heatsinks to electronic components. It ensures efficient heat transfer while providing a strong and durable bond.
Key Features:
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Thermal Conductivity: Enables effective heat dissipation for improved component cooling.
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Temperature Resistance: Operates in high temperatures up to 200°C.
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Quick Drying: Surface drying occurs within minutes, with full curing in 24 to 48 hours.
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Strong Adhesion: Provides a secure bond between components and heatsinks.
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Easy Application: Comes in a 10g syringe for precise and controlled use.
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White Color: Helps in visibility and even application.
Usage Instructions:
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Prepare the Surface: Ensure both surfaces are clean and dry.
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Apply the Adhesive: Spread a thin, even layer (up to 6mm).
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Press and Hold: Join the components together and apply light pressure.
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Allow to Cure: Let it dry for the recommended time for maximum strength.
