Mid Layer General Purpose Tin Planting Platform For I Phone 16 Series (Ycs)

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Mid Layer General Purpose Tin Planting Platform For I Phone 16 Series (Ycs)

Name: Mid Layer General Purpose Tin Planting Platform For I Phone 16 Series (Ycs)
Brand: FHT&MS
SKU: 107182117258
Price: 225.67 NOK
Availability: InStock

SKU: 107182117258

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225,67 kr

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Mid-layer solder mesh designed for precise reballing of iPhone 16 Pro and 16 Pro Max multilayer logic boards

Restores damaged or missing solder points across internal board layers

Ensures accurate alignment during reconstruction of middle-layer solder pads

Ideal for repairing CPU, PMIC and complex IC modules in the iPhone 16 Pro series

High-temperature resistant mesh optimized for professional microsoldering environments

YCS mesh engineered for consistent accuracy in advanced board-level rework

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Mid Layer General Purpose Tin Planting Platform For I Phone 16 Series (Ycs)

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Mid Layer General Purpose Tin Planting Platform For I Phone 16 Series (Ycs)

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